Wafer Back / Front Coat
Semiconductor & Electronics Manufcturing Services
Wafer Back / Front Coat Capability:
-- Can accommodate up to 8 inches wafer diameter with up to 200 microns wafer thickness.
-- Coat printing of up to 10 microns thickness
-- With rotary squeegee – suppressing the deterioration and amount of solder/adhesive used
-- We have the technology to print the whole wafer backside circumferential area
-- Can print CSP bumps of 0.05mm diameter with the world’s highest class accuracy in repetitive printing positioning – (0.03mm or less when image recognition is used)
Wafer Ball Drop / Wafer Bumping
Semiconductor & Electronics Manufcturing Services
Wafer Ball Drop / Bumping capability
-- Can accommodate 8" to 12" wafer with up to 160 microns thickness.
-- Ball diameter _ 90 microns
-- Ball pitch _ 160 microns
-- High ball placement yield and high speed ball capture
-- No damage to solder balls
-- Non-contact type head : no damage to stencil
-- No contact with printed flux and avoids stencil contamination. Enables continuous ball placing.
-- No cleaning required
