Capable to do 0603 metric 0201 english chip placement.
BGA and CSP mounting capability
Reflow -7 to 8 zone profile, with or without N2 lead-free and ROHs compliant
We can also handle thru hole process, with wave soldering machine
Screen Printer Technology:
-- Rotary squeegee with pressurized printing system for improved mark separation
-- Can print paste and mount components on depressed PCB areas
-- Can print paste on 2 stage solder thickness for micro size parts & standard size parts
PCBA Thru hole Capability with SMD's
Lead-Free , ROHS compliant
With Sub-Assembly process and
Test capability (functional and ICT)
Wave Solder or Manual Soldering
Caters also to Low-Volume-High-Mix product orders
Flexible Printed Circuit Assembly (FPCA)
Universal Baseplate with Aligner
Flexible Printed Circuit Assembly (FPCA) either
on sheet (panelized) or singulated, including the
sub-assembly support needed for eac FPCA end application
PCBA / FPCA Electrical Test
-- FT: Functional Test
-- ICT: In-Circuit Test
Standard SMT Line Configuration
Reach Us
Leave your Email Address, and we’ll contact you immediately
President / CEO
Fernando "Itoy" Silva +63 917 878 8778
141 East Main Loop, Phase 6A, Laguna Technopark, Inc., Binan, Laguna, Philippines 4024